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1. WO2021006092 - SEPARATING DEVICE AND SEPARATING METHOD

Publication Number WO/2021/006092
Publication Date 14.01.2021
International Application No. PCT/JP2020/025506
International Filing Date 29.06.2020
IPC
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP]
Inventors
  • 中野 征二 NAKANO, Seiji
  • 山脇 陽平 YAMAWAKI, Yohei
  • 川口 義広 KAWAGUCHI, Yoshihiro
Agents
  • 金本 哲男 KANEMOTO, Tetsuo
  • 萩原 康司 HAGIWARA, Yasushi
  • 扇田 尚紀 OGITA, Naoki
  • 三根 卓也 MINE, Takuya
Priority Data
2019-12817810.07.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEPARATING DEVICE AND SEPARATING METHOD
(FR) DISPOSITIF DE SÉPARATION ET PROCÉDÉ DE SÉPARATION
(JA) 分離装置及び分離方法
Abstract
(EN)
Provided is a separating device for separating an object being processed into a first separated body and a second separated body, the separating device comprising: a first holding unit for holding the first separated body; a second holding unit for holding the second separated body; a moving unit for causing the first holding unit and the second holding unit to be moved relative to each other; and a pivoting unit which causes at least the first separated body or the second separated body to pivot so that a separation surface of the first separated body faces upward and a separation surface of the second separated body faces upward.
(FR)
La présente invention concerne un dispositif de séparation destiné à séparer un objet en cours de traitement en un premier corps séparé et un second corps séparé, le dispositif de séparation comprenant : une première unité de maintien destinée à maintenir le premier corps séparé ; une seconde unité de maintien destinée à maintenir le second corps séparé ; une unité de déplacement destinée à amener la première unité de maintien et la seconde unité de maintien à être déplacées l'une par rapport à l'autre ; et une unité de pivotement qui amène au moins le premier corps séparé ou le second corps séparé à pivoter de sorte qu'une surface de séparation du premier corps séparé soit orientée vers le haut et qu'une surface de séparation du second corps séparé soit orientée vers le haut.
(JA)
処理対象体を第1の分離体と第2の分離体に分離する分離装置であって、前記第1の分離体を保持する第1の保持部と、前記第2の分離体を保持する第2の保持部と、前記第1の保持部と前記第2の保持部を相対的に移動させる移動部と、前記第1の分離体の分離面が上方を向き、且つ、前記第2の分離体の分離面が上方を向くように、少なくとも前記第1の分離体又は前記第2の分離体を回動させる回動部と、を有する。
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