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1. WO2020231417 - RE-WORKABLE ADHESIVES FOR ELECTRONIC DEVICES

Publication Number WO/2020/231417
Publication Date 19.11.2020
International Application No. PCT/US2019/032357
International Filing Date 15.05.2019
IPC
C09J 201/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 175/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
C09J 133/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 177/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
177Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
C09J 107/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
107Adhesives based on natural rubber
Applicants
  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US]/[US]
Inventors
  • WU, Kuan-Ting
  • LIAO, Super
  • KU, Chung-Hua
Agents
  • COSTALES, Shruti
  • OAKESON, Gary P.
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) RE-WORKABLE ADHESIVES FOR ELECTRONIC DEVICES
(FR) ADHÉSIFS RÉUTILISABLES POUR DISPOSITIFS ÉLECTRONIQUES
Abstract
(EN)
The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt% to about 90 wt% with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt% to about 40 wt% with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.
(FR)
La présente invention a trait à des adhésifs réutilisables pour des dispositifs électroniques. Dans un exemple, un adhésif réutilisable pour un dispositif électronique peut comprendre un adhésif thermofusible présent en une quantité d'environ 60 % en poids à environ 90 % en poids par rapport au poids total de l'adhésif réutilisable. L'adhésif thermofusible peut avoir une force de liaison réduite à une température élevée. L'adhésif réutilisable peut également comprendre un adhésif sensible à la pression présent en une quantité d'environ 10 % en poids à environ 40 % en poids par rapport au poids total de l'adhésif réutilisable, l'adhésif sensible à la pression ayant une force de liaison plus élevée par comparaison avec l'adhésif thermofusible lorsqu'il est à la température élevée.
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