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1. WO2020231037 - SUBSTRATE DRYING CHAMBER

Publication Number WO/2020/231037
Publication Date 19.11.2020
International Application No. PCT/KR2020/005421
International Filing Date 24.04.2020
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
H01L 21/67034
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
67034for drying
H01L 21/67098
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
H01L 21/67126
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
Applicants
  • 무진전자 주식회사 MUJIN ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • 신희용 SHIN, Hee Yong
  • 윤병문 YOON, Byoung Moon
Agents
  • 특허법인(유한) 다래 DARAE LAW & IP, LLC
Priority Data
10-2019-005554913.05.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SUBSTRATE DRYING CHAMBER
(FR) CHAMBRE DE SÉCHAGE DE SUBSTRAT
(KO) 기판 건조 챔버
Abstract
(EN)
A substrate drying chamber according to the present invention comprises: an upper housing; a lower housing; a substrate placing plate; an upper supply port which provides a supply path for a supercritical fluid for drying; an integrated supply/discharge port which provides a supply path for a supercritical fluid for initial pressurization and a discharge path for a mixed fluid obtained by dissolving an organic solvent in a supercritical fluid for drying after drying is performed by the supply of the supercritical fluid for drying; an agitator which agitates the supercritical fluid for initial pressurization and the supercritical fluid for drying; and a heating member which operates to heat the supercritical fluid for initial pressurization and the mixed fluid when the supercritical fluid for initial pressurization is supplied or the mixed fluid is discharged.
(FR)
La présente invention concerne une chambre de séchage de substrat comprenant : un boîtier supérieur ; un boîtier inférieur ; une plaque de placement de substrat ; un orifice de fourniture supérieur qui fournit un trajet de fourniture d'un fluide supercritique servant au séchage ; un orifice de fourniture/d'évacuation intégré qui fournit un trajet de fourniture d'un fluide supercritique servant à la mise sous pression initiale et un trajet d'évacuation d'un fluide mélangé obtenu par dissolution d'un solvant organique dans un fluide supercritique servant au séchage après que le séchage a été effectué par la fourniture du fluide supercritique servant au séchage ; un agitateur qui agite le fluide supercritique servant à la mise sous pression initiale et le fluide supercritique servant au séchage ; et un élément chauffant qui fonctionne pour chauffer le fluide supercritique servant à la mise sous pression initiale et le fluide mélangé lorsque le fluide supercritique servant à la mise sous pression initiale est fourni ou que le fluide mélangé est évacué.
(KO)
본 발명에 따른 기판 건조 챔버는 상부 하우징, 하부 하우징, 기판 배치판, 건조용 초임계유체의 공급경로를 제공하는 상부 공급포트, 초기 가압용 초임계유체의 공급경로 및 건조용 초임계유체의 공급에 따른 건조 후 초임계유체에 유기용제가 용해된 혼합유체의 배출경로를 제공하는 일체형 공급/배출포트, 초기 가압용 초임계유체와 건조용 초임계유체를 교반하는 교반기 및 초기 가압용 초임계유체의 공급 시 및 혼합유체의 배출 시에 동작하여 초기 가압용 초임계유체 및 혼합유체를 가열하는 가열부재를 포함한다.
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