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1. WO2020228235 - ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND FLEXIBLE DISPLAY PANEL

Publication Number WO/2020/228235
Publication Date 19.11.2020
International Application No. PCT/CN2019/111106
International Filing Date 14.10.2019
IPC
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 21/84 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
82to produce devices, e.g. integrated circuits, each consisting of a plurality of components
84the substrate being other than a semiconductor body, e.g. being an insulating body
CPC
H01L 27/1218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1218with a particular composition or structure of the substrate
H01L 27/1262
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1259Multistep manufacturing methods
1262with a particular formation, treatment or coating of the substrate
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 卢瑞 LU, Rui
  • 王一佳 WANG, Yijia
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201910397797.614.05.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND FLEXIBLE DISPLAY PANEL
(FR) SUBSTRAT MATRICIEL ET SON PROCÉDÉ DE PRÉPARATION, ET PANNEAU D'AFFICHAGE FLEXIBLE
(ZH) 阵列基板及其制备方法、柔性显示面板
Abstract
(EN)
An array substrate, comprising a base, at least one inorganic film layer, and at least one organic soft film layer. The organic soft film layer is provided on the side of the inorganic film layer close to the base, and the surface of the side of the organic soft film layer close to the inorganic film layer is wavy. By generating a compressive stress on the organic soft film layer by means of the inorganic film layer, the organic soft film layer is wavily deformed, and the inorganic film layer also forms a wavy shape, thereby reducing stress concentration when a panel is bent and improving bending performance of a flexible display panel.
(FR)
L'invention concerne un substrat matriciel, comprenant une base, au moins une couche de film inorganique et au moins une couche de film souple organique. La couche de film souple organique est disposée sur le côté de la couche de film inorganique proche de la base, et la surface du côté de la couche de film souple organique proche de la couche de film inorganique est ondulée. En générant une contrainte de compression sur la couche de film souple organique au moyen de la couche de film inorganique, la couche de film souple organique est déformée par ondulation, et la couche de film inorganique forme également une forme ondulée, ce qui permet de réduire la concentration de contrainte lorsqu'un panneau est plié et d'améliorer les performances de flexion d'un panneau d'affichage souple.
(ZH)
一种阵列基板包括一衬底、至少一无机膜层、以及至少一有机软膜层,有机软膜层设置于无机膜层靠近衬底的一侧,有机软膜层靠近无机膜层的一侧表面呈波浪形。通过利用无机膜层对有机软膜层产生压应力,使得有机软膜层发生波浪形变,无机膜层也随之形成波浪形,减弱面板在弯折时的应力集中现象,提高柔性显示面板的弯折性能。
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