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1. WO2020177110 - FORMALDEHYDE FREE ADHESIVE COMPOSITION

Publication Number WO/2020/177110
Publication Date 10.09.2020
International Application No. PCT/CN2019/077265
International Filing Date 07.03.2019
IPC
C08L 63/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 33/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Compositions of derivatives of such polymers
04Homopolymers or copolymers of esters
06of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
08Homopolymers or copolymers of acrylic acid esters
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 133/08 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04Homopolymers or copolymers of esters
06of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
08Homopolymers or copolymers of acrylic acid esters
Applicants
  • DOW GLOBAL TECHNOLOGIES LLC [US]/[US]
  • DOW SILICONES CORPORATION [US]/[US]
  • HU, Minbiao [CN]/[CN] (SC)
  • SUN, Tong [CN]/[CN] (SC)
  • JIANG, Jingui [CN]/[CN] (SC)
  • PAN, Shi [CN]/[CN] (SC)
  • FENG, Shaoguang [US]/[CN] (SC)
  • ZHAI, Xuemei [CN]/[CN] (SC)
Inventors
  • HU, Minbiao
  • SUN, Tong
  • JIANG, Jingui
  • PAN, Shi
  • FENG, Shaoguang
  • ZHAI, Xuemei
Agents
  • SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FORMALDEHYDE FREE ADHESIVE COMPOSITION
(FR) COMPOSITION ADHÉSIVE EXEMPTE DE FORMALDÉHYDE
Abstract
(EN)
A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.
(FR)
L'invention concerne une composition adhésive exempte de formaldéhyde et un contreplaqué obtenu par la composition adhésive, le contreplaqué conservant les performances souhaitées, telles que la résistance à l'eau et l'aptitude au façonnage.
Also published as
EP19914180.5
EP2019914180
Latest bibliographic data on file with the International Bureau