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1. WO2020130507 - THERMOELECTRIC MODULE

Publication Number WO/2020/130507
Publication Date 25.06.2020
International Application No. PCT/KR2019/017688
International Filing Date 13.12.2019
IPC
H01L 35/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device
H01L 35/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
04Structural details of the junction; Connections of leads
H01L 35/34 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Applicants
  • 엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR]/[KR]
Inventors
  • 조민성 JO, Min Sung
Agents
  • 특허법인 다나 DANA PATENT LAW FIRM
Priority Data
10-2018-016643720.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) THERMOELECTRIC MODULE
(FR) MODULE THERMOÉLECTRIQUE
(KO) 열전 모듈
Abstract
(EN)
Disclosed is a thermoelectric module. One embodiment of the thermoelectric modules comprises: a first substrate; a first electrode disposed on the first substrate; a thermoelectric leg disposed on the first electrode; a second electrode disposed on the thermoelectric leg; a second substrate disposed on the second electrode; a plurality of wire parts electrically connected to the first electrode and the second electrode; a first sealing part disposed on the first substrate and surrounding the side surface of the second substrate; and a second sealing part passing through the first sealing part and disposed on the inside and outside of the first sealing part. At least one of the plurality of wire parts is partially disposed inside the second sealing part. The second sealing part includes: a first region which is closest to the first sealing part outside the first sealing part,; and a second region which is disposed outside the first region and is in contact with the wire part partially disposed inside the second sealing part, wherein the thickness of the second region is less than the thickness of the first region.
(FR)
La présente invention concerne un module thermoélectrique. Un mode de réalisation des modules thermoélectriques comprend : un premier substrat; une première électrode disposée sur le premier substrat; une patte thermoélectrique disposée sur la première électrode; une seconde électrode disposée sur la patte thermoélectrique; un second substrat disposé sur la seconde électrode; une pluralité de parties de fil électriquement connectées à la première électrode et à la seconde électrode; une première partie d'étanchéité disposée sur le premier substrat et entourant la surface latérale du second substrat; et une seconde partie d'étanchéité traversant la première partie d'étanchéité et disposée sur l'intérieur et l'extérieur de la première partie d'étanchéité. Au moins une partie de la pluralité de parties de fil est partiellement disposée à l'intérieur de la seconde partie d'étanchéité. La seconde partie d'étanchéité comprend : une première région qui est la plus proche extérieurement de la première partie d'étanchéité; et une seconde région qui est disposée à l'extérieur de la première région et est en contact avec la partie de fil disposée partiellement à l'intérieur de la seconde partie d'étanchéité, l'épaisseur de la seconde région étant inférieure à l'épaisseur de la première région.
(KO)
실시예는 제1 기판; 제1 기판 상에 배치되는 제1 전극; 상기 제1 전극 상에 배치되는 열전 레그; 상기 열전 레그 상에 배치되는 제2 전극; 상기 제2 전극 상에 배치되는 제2 기판; 상기 제1 전극 및 상기 제2 전극과 전기적으로 연결된 복수의 전선부; 상기 제1 기판 상에 배치되고, 상기 제2 기판의 측면을 둘러싸는 제1 실링부; 및 상기 제1 실링부을 관통하여 상기 제1 실링부의 내측 및 외측에 배치된 제2 실링부;를 포함하며, 상기 복수의 전선부 중 적어도 하나는 상기 제2 실링부 내에 일부 배치되며, 상기 제2 실링부는, 상기 제1 실링부의 외측에서 상기 제1 실링부에 가장 인접한 제1 영역; 및 상기 제1 영역의 외측에 배치되며, 상기 제2 실링부 내에 일부 배치되는 상기 전선부와 접하는 제2 영역을 포함하고, 상기 제2 영역의 두께는 상기 제1 영역의 두께보다 작은 열전 모듈을 개시한다.
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